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COMSOL Inc 3-d smtc thermal model
Schematic diagram of a hollow structure <t>SMTC</t> from the bottom side.
3 D Smtc Thermal Model, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/3-d+smtc+thermal+model/pmc11596950-152-1-9?v=COMSOL+Inc
Average 90 stars, based on 1 article reviews
3-d smtc thermal model - by Bioz Stars, 2026-07
90/100 stars

Images

1) Product Images from "Silicon Microthermocycler for Point-of-Care Analytical Systems: Modeling, Design, and Fabrication"

Article Title: Silicon Microthermocycler for Point-of-Care Analytical Systems: Modeling, Design, and Fabrication

Journal: Micromachines

doi: 10.3390/mi15111325

Schematic diagram of a hollow structure SMTC from the bottom side.
Figure Legend Snippet: Schematic diagram of a hollow structure SMTC from the bottom side.

Techniques Used:

Four regions in the final SMTC structure (see the last paragraph in ) where the simulated tensile stress due to a downward load is the highest. View from the top ( left ) and view from the bottom ( right ).
Figure Legend Snippet: Four regions in the final SMTC structure (see the last paragraph in ) where the simulated tensile stress due to a downward load is the highest. View from the top ( left ) and view from the bottom ( right ).

Techniques Used:

Simulated temperature distribution in the final SMTC structure (see the last paragraph in ), revealing the efficiency of the tethers and separation ring in terms of thermal separation of a central unit from a substrate.
Figure Legend Snippet: Simulated temperature distribution in the final SMTC structure (see the last paragraph in ), revealing the efficiency of the tethers and separation ring in terms of thermal separation of a central unit from a substrate.

Techniques Used:

SMTC fabrication process scheme.
Figure Legend Snippet: SMTC fabrication process scheme.

Techniques Used:

The main board with the supporting PCB board and the SMTC chip ( a ). The measurement configuration of a semiconductor parametric analyzer ( b ).
Figure Legend Snippet: The main board with the supporting PCB board and the SMTC chip ( a ). The measurement configuration of a semiconductor parametric analyzer ( b ).

Techniques Used:

Influence of crucial design parameters on the ( a ) mechanical strength and ( b – f ) thermal properties of the SMTC.
Figure Legend Snippet: Influence of crucial design parameters on the ( a ) mechanical strength and ( b – f ) thermal properties of the SMTC.

Techniques Used:

Time constant τ of the SMTC as a function of crucial design parameter values.
Figure Legend Snippet: Time constant τ of the SMTC as a function of crucial design parameter values.

Techniques Used:

Measured thin film heater and RTD resistance at selected temperatures by heating the SMTC on a laboratory temperature-stabilized heater.
Figure Legend Snippet: Measured thin film heater and RTD resistance at selected temperatures by heating the SMTC on a laboratory temperature-stabilized heater.

Techniques Used:



Similar Products

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COMSOL Inc 3-d smtc thermal model
Schematic diagram of a hollow structure <t>SMTC</t> from the bottom side.
3 D Smtc Thermal Model, supplied by COMSOL Inc, used in various techniques. Bioz Stars score: 90/100, based on 1 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/3-d+smtc+thermal+model/pmc11596950-152-1-9?v=COMSOL+Inc
Average 90 stars, based on 1 article reviews
3-d smtc thermal model - by Bioz Stars, 2026-07
90/100 stars
  Buy from Supplier

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Schematic diagram of a hollow structure SMTC from the bottom side.

Journal: Micromachines

Article Title: Silicon Microthermocycler for Point-of-Care Analytical Systems: Modeling, Design, and Fabrication

doi: 10.3390/mi15111325

Figure Lengend Snippet: Schematic diagram of a hollow structure SMTC from the bottom side.

Article Snippet: The 3-D SMTC thermal model was built in the Comsol simulation environment.

Techniques:

Four regions in the final SMTC structure (see the last paragraph in ) where the simulated tensile stress due to a downward load is the highest. View from the top ( left ) and view from the bottom ( right ).

Journal: Micromachines

Article Title: Silicon Microthermocycler for Point-of-Care Analytical Systems: Modeling, Design, and Fabrication

doi: 10.3390/mi15111325

Figure Lengend Snippet: Four regions in the final SMTC structure (see the last paragraph in ) where the simulated tensile stress due to a downward load is the highest. View from the top ( left ) and view from the bottom ( right ).

Article Snippet: The 3-D SMTC thermal model was built in the Comsol simulation environment.

Techniques:

Simulated temperature distribution in the final SMTC structure (see the last paragraph in ), revealing the efficiency of the tethers and separation ring in terms of thermal separation of a central unit from a substrate.

Journal: Micromachines

Article Title: Silicon Microthermocycler for Point-of-Care Analytical Systems: Modeling, Design, and Fabrication

doi: 10.3390/mi15111325

Figure Lengend Snippet: Simulated temperature distribution in the final SMTC structure (see the last paragraph in ), revealing the efficiency of the tethers and separation ring in terms of thermal separation of a central unit from a substrate.

Article Snippet: The 3-D SMTC thermal model was built in the Comsol simulation environment.

Techniques:

SMTC fabrication process scheme.

Journal: Micromachines

Article Title: Silicon Microthermocycler for Point-of-Care Analytical Systems: Modeling, Design, and Fabrication

doi: 10.3390/mi15111325

Figure Lengend Snippet: SMTC fabrication process scheme.

Article Snippet: The 3-D SMTC thermal model was built in the Comsol simulation environment.

Techniques:

The main board with the supporting PCB board and the SMTC chip ( a ). The measurement configuration of a semiconductor parametric analyzer ( b ).

Journal: Micromachines

Article Title: Silicon Microthermocycler for Point-of-Care Analytical Systems: Modeling, Design, and Fabrication

doi: 10.3390/mi15111325

Figure Lengend Snippet: The main board with the supporting PCB board and the SMTC chip ( a ). The measurement configuration of a semiconductor parametric analyzer ( b ).

Article Snippet: The 3-D SMTC thermal model was built in the Comsol simulation environment.

Techniques:

Influence of crucial design parameters on the ( a ) mechanical strength and ( b – f ) thermal properties of the SMTC.

Journal: Micromachines

Article Title: Silicon Microthermocycler for Point-of-Care Analytical Systems: Modeling, Design, and Fabrication

doi: 10.3390/mi15111325

Figure Lengend Snippet: Influence of crucial design parameters on the ( a ) mechanical strength and ( b – f ) thermal properties of the SMTC.

Article Snippet: The 3-D SMTC thermal model was built in the Comsol simulation environment.

Techniques:

Time constant τ of the SMTC as a function of crucial design parameter values.

Journal: Micromachines

Article Title: Silicon Microthermocycler for Point-of-Care Analytical Systems: Modeling, Design, and Fabrication

doi: 10.3390/mi15111325

Figure Lengend Snippet: Time constant τ of the SMTC as a function of crucial design parameter values.

Article Snippet: The 3-D SMTC thermal model was built in the Comsol simulation environment.

Techniques:

Measured thin film heater and RTD resistance at selected temperatures by heating the SMTC on a laboratory temperature-stabilized heater.

Journal: Micromachines

Article Title: Silicon Microthermocycler for Point-of-Care Analytical Systems: Modeling, Design, and Fabrication

doi: 10.3390/mi15111325

Figure Lengend Snippet: Measured thin film heater and RTD resistance at selected temperatures by heating the SMTC on a laboratory temperature-stabilized heater.

Article Snippet: The 3-D SMTC thermal model was built in the Comsol simulation environment.

Techniques: